| Order Quantity | ≥1 STK |
| Kwaliteitsklasse | IPC-A-610 |
| Trochrintiid | 48H foar fersnelling; 4-5 dagen foar prototype; Oare kwantiteit foarsjen by quoting |
| Grutte | 50*50mm-510*460mm |
| Board Type | Rigid Fleksibel Rigid-fleksibel Metal kearn |
| Min Pakket | 01005(0.4mm*0.2mm) |
| Montage Accuracy | ± 0,035 mm (± 0,025 mm) Cpk≥ 1,0 |
| Oerflakte ôfwurking | Lead / Lead FERGESE HASL, Immersion goud, OSP, ensfh |
| Assembly Type | THD (Thru-hole apparaat) / Konvinsjoneel SMT (Surface-mount technology) SMT & THD mingd Dûbelsidich SMT- en / of THD-assemblage |
| Components Sourcing | Turnkey (Alle komponinten krigen troch ANKE), foar in part turnkey, ferstjoerd |
| BGA Pakket | BGA Dia 0.14mm, BGA 0.2MM Pitch |
| Component ferpakking | Reels, Cut tape, Tube, Tray, Losse dielen |
| Kabel Assembly | Oanpaste kabels, kabelgearkomsten, bedrading / harnas |
| Stencil | Stencil mei of sûnder frame |
| Untwerp triemformaat | Gerber RS-274X, 274D, Eagle en AutoCAD's DXF, DWG BOM (Bill of Materials) Kies en plak triem (XYRS) |
| Kwaliteit Ynspeksje | X-ray ynspeksje, AOI (Automated Optical Inspector), Funksjonele test (testmodules moatte wurde levere) Burn-in test |
| SMT Kapasiteit | 3 miljoen-4 miljoen soldering pad / dei |
| DIP kapasiteit | 100 tûzen pin / dei |
