Leveringskapasiteit
| Rigid Board-kapasiteit | |
| Oantal lagen: | 1-42 lagen |
| Materiaal: | Fr4 \ High Tg Fr4 \ Lead Free Materiaal \ CEM1 \ CEM3 \ aluminium \ metal kearn \ PTFE \ ROGERS |
| Utlaach CU-dikte: | 1-6oz |
| Binnenlaach CU Dikte: | 1-4oz |
| Maksimum ferwurkingsgebiet: | 610 * 1100mm |
| Minimale boerd dikte: | 2 Layers 0,3mm (12Mil) 4 Layers 0.4mm (16Mil) 6 Layers 0.8mm (32Mil) 8 Layers 1.0mm (40MIL) 10 Layers 1.1MM (44Mil) 12 Layers 1.3MM (52Mil) 14 Layers 1.5MM (59Mil) 16 Layers 1.6MM (63Mil) |
| Minimum breedte: | 0.076mm (3Mil) |
| Minimale romte: | 0.076mm (3Mil) |
| Minimale gatgrutte (definityf gat): | 0.2mm |
| Aspektatio: | 10: 1 |
| Drilling gatgrutte: | 0.2-0.65mm |
| Boarjen tolerânsje: | + \ - 0,05mm (2mil) |
| PTH-tolerânsje: | Φ0.2-1,6mm + \ - 0.075mm (3MIL) Φ1.6-6.3mm + \ - 0.1mm (4mil) |
| NPTH-tolerânsje: | Φ0.2-1,6mm + \ - 0,05mm (2mil) Φ1.6-6.3mm + \ - 0,05mm (2mil) |
| Finish Board Tolerance: | Dikte <0,8mm, tolerânsje: +/- 0,08mm |
| 0.8mm≤dephickness≤6.5mm, tolerânsje +/- 10% | |
| Minimale Soldermaskbrêge: | 0.076mm (3Mil) |
| Twisting en bûgjen: | ≤0.75% min0.5% |
| Raneg of Tg: | 130-215 ℃ |
| Impedance tolerânsje: | +/- 10%, min +/- 5% |
| SURFIRME TREAT:
| Hasl, LF Hasl |
| Immersing goud, flash goud, gouden finger | |
| Immersion sulver, immersion tin, osp | |
| SELECTIVE GOLD PLATING, GOUD OP 3UM (120U ") | |
| Koalstofprint, peelable s / m, enepig | |
| Aluminium bestjoerskapasiteit | |
| Oantal lagen: | Single laach, dûbele lagen |
| Maksimum boerdgrutte: | 1500 * 600mm |
| Board Dikte: | 0.5-3.0mm |
| Koper dikte: | 0,5-4oz |
| Minimale gatgrutte: | 0.8mm |
| Minimum breedte: | 0.1mm |
| Minimale romte: | 0.12mm |
| Minimale padgrutte: | 10 Micron |
| Oerflakfinish: | Hasl, Osp, Enig |
| Foarm: | CNC, punching, V-Cut |
| Equemint: | Universele tester |
| Fleanende sonde iepen / koarte tester | |
| Hege krêft mikroskoop | |
| Testingskit foar solderability test | |
| Peel sterkte tester | |
| Hege volt iepen & koarte tester | |
| Krús seksje Molding kit mei polisher | |
| FPC-kapasiteit | |
| Layers: | 1-8 lagen |
| Board Dikte: | 0,05-0.5mm |
| Koper dikte: | 0.5-3oz |
| Minimum breedte: | 0.075mm |
| Minimale romte: | 0.075mm |
| Yn troch gatgrutte: | 0.2mm |
| Minimum Laser Hole Grutte: | 0.075mm |
| Minimale punching gatgrutte: | 0.5mm |
| Soldermask tolerânsje: | + \ - 0,5mm |
| Minimale routing DIMENSJE TOLSERANSJE: | + \ - 0,5mm |
| Oerflakfinish: | Hasl, LF Hasl, immersing sulver, immersion goud, flash goud, Osp |
| Foarm: | Punching, laser, snije |
| Equemint: | Universele tester |
| Fleanende sonde iepen / koarte tester | |
| Hege krêft mikroskoop | |
| Testingskit foar solderability test | |
| Peel sterkte tester | |
| Hege volt iepen & koarte tester | |
| Krús seksje Molding kit mei polisher | |
| Rigid & Flex Kapasiteit | |
| Layers: | 1-28 Layers |
| Materiaal type: | FR-4 (Hege TG, Halogen Frij, Hege frekwinsje) PTFE, BT, Getek, Getek, Aluminiumbasis, Copper Base, KB, Nanya, Shengyi, Iteq, Islol, Nelco, Rogers, Arlon |
| Board Dikte: | 6-240mil / 0.15-6.0mm |
| Koper dikte: | 210um (6oz) foar binnenlaach 210um (6oz) foar bûtenlagen |
| Min meganyske drillgrutte: | 0.2mm / 0.08 " |
| Aspektatio: | 2: 1 |
| Max panielgrutte: | Sigle Side as dûbele kanten: 500mm * 1200mm |
| Multilayer Layers: 508mm x 610mm (20 "x 24") | |
| Min line breedte / romte: | 0,076mm / 0.076mm (0.003 "/ 0,003") / 3Mil / 3Mil |
| Fia gat type: | Blind / Begraven / PLUGGED (VOP, VIP ...) |
| HDI / Microvia: | JA |
| Oerflakfinish: | Hasl, LF Hasl |
| Immersing goud, flash goud, gouden finger | |
| Immersion sulver, immersion tin, osp | |
| SELECTIVE GOLD PLATING, GOUD OP 3UM (120U ") | |
| Koalstofprint, peelable s / m, enepig | |
| Foarm: | CNC, punching, V-Cut |
| Equemint: | Universele tester |
| Fleanende sonde iepen / koarte tester | |
| Hege krêft mikroskoop | |
| Testingskit foar solderability test | |
| Peel sterkte tester | |
| Hege volt iepen & koarte tester | |
| Krús seksje Molding kit mei polisher | |
