| Order Quantity | ≥1 STK |
| Kwaliteitsklasse | IPC-A-610 |
| Trochrintiid | 48H foar fersnelling; |
| 4-5 dagen foar prototype; | |
| Oare kwantiteit foarsjen by quoting | |
| Grutte | 50*50mm-510*460mm |
| Board Type | Rigid |
| Fleksibel | |
| Rigid-fleksibel | |
| Metal kearn | |
| Min Pakket | 01005(0.4mm*0.2mm) |
| Montage Accuracy | ± 0,035 mm (± 0,025 mm) Cpk≥ 1,0 |
| Oerflakte ôfwurking | Lead / Lead FERGESE HASL, Immersion goud, OSP, ensfh |
| Assembly Type | THD (Thru-hole apparaat) / Konvinsjoneel |
| SMT (Surface-mount technology) | |
| SMT & THD mingd | |
| Dûbelsidich SMT- en / of THD-assemblage | |
| Components Sourcing | Turnkey (Alle komponinten krigen troch ANKE), foar in part turnkey, ferstjoerd |
| BGA Pakket | BGA Dia 0.14mm, BGA 0.2MM Pitch |
| Component ferpakking | Reels, Cut tape, Tube, Tray, Losse dielen |
| Kabel Assembly | Oanpaste kabels, kabelgearkomsten, bedrading / harnas |
| Stencil | Stencil mei of sûnder frame |
| Untwerp triemformaat | Gerber RS-274X, 274D, Eagle en AutoCAD's DXF, DWG |
| BOM (Bill of Materials) | |
| Kies en plak triem (XYRS) | |
| Kwaliteit Ynspeksje | X-ray ynspeksje, |
| AOI (Automated Optical Inspector), | |
| Funksjonele test (testmodules moatte wurde levere) | |
| Burn-in test | |
| SMT Kapasiteit | 3 miljoen-4 miljoen soldering pad / dei |
| DIP kapasiteit | 100 tûzen pin / dei |
Post tiid: Sep-05-2022
