| Rigid board kapasiteit | |
| Oantal lagen: | 1-42 lagen |
| Materiaal: | FR4\high TG FR4\Lead free materiaal\CEM1\CEM3\Aluminium\Metal core\PTFE\Rogers |
| Out laach Cu dikte: | 1-6OZ |
| Binnenste laach Cu dikte: | 1-4OZ |
| Maksimum ferwurkingsgebiet: | 610 * 1100 mm |
| Minimum board dikte: | 2 lagen 0,3 mm (12 mil) |
| 4 lagen 0,4 mm (16 mil) | |
| 6 lagen 0,8 mm (32 mil) | |
| 8 lagen 1,0 mm (40 mil) | |
| 10 lagen 1,1 mm (44 mil) | |
| 12 lagen 1,3 mm (52 mil) | |
| 14 lagen 1,5 mm (59 mil) | |
| 16 lagen 1.6mm (63mil) | |
| Minimum breedte: | 0.076 mm (3 mil) |
| Minimum romte: | 0.076 mm (3 mil) |
| Minimum gat grutte (final gat): | 0,2 mm |
| Aspektferhâlding: | 10:01 |
| Drilling gat grutte: | 0,2-0,65 mm |
| Boaring tolerânsje: | +\-0,05 mm (2 mil) |
| PTH tolerânsje: | Φ0.2-1.6mm +\-0.075mm (3mil) |
| Φ1.6-6.3mm+\-0.1mm(4mil) | |
| NPTH tolerânsje: | Φ0.2-1.6mm +\-0.05mm (2mil) |
| Φ1.6-6.3mm+\-0.05mm(2mil) | |
| Finish board tolerânsje: | Dikte ＜0.8mm, Tolerânsje: +/- 0.08mm |
| 0.8mm≤Dikte≤6.5mm,Tolerânsje+/-10% | |
| Minimum soldermask brêge: | 0.076 mm (3 mil) |
| Draaien en bûgen: | ≤0.75% Min0.5% |
| Raneg of TG: | 130-215 ℃ |
| Impedânsje tolerânsje: | +/-10%, Min+/-5% |
| Oerflak behanneling: | HASL, LF HASL |
| Immersion Gold, Flash Gold, Gold finger | |
| Immersion Silver, Immersion Tin, OSP | |
| Selektyf gouden plating, gouddikte oant 3um (120u") | |
| Carbon Print, Peelable S/M, ENEPIG | |
| Aluminium board kapasiteit | |
| Oantal lagen: | Single laach, dûbele lagen |
| Maksimum board grutte: | 1500 * 600 mm |
| Board dikte: | 0,5-3,0 mm |
| Koper dikte: | 0,5-4oz |
| Minimum gat grutte: | 0.8mm |
| Minimum breedte: | 0.1mm |
| Minimum romte: | 0,12 mm |
| Minimum pad grutte: | 10 mikron |
| Oerflakte ôfwurking: | HASL, OSP, ENIG |
| Foarm: | CNC, Punching, V-cut |
| Apparatuer: | Universele tester |
| Flying Probe Iepen / Koarte Tester | |
| Hege krêft mikroskoop | |
| Solderability Testing Kit | |
| Peel Strength tester | |
| High Volt Open & Koarte tester | |
| Cross Section Molding Kit Mei Polisher | |
| FPC Kapasiteit | |
| Lagen: | 1-8 lagen |
| Board dikte: | 0,05-0,5 mm |
| Koper dikte: | 0,5-3 OZ |
| Minimum breedte: | 0.075 mm |
| Minimum romte: | 0.075 mm |
| Yn troch gat grutte: | 0,2 mm |
| Minimum laser gat grutte: | 0.075 mm |
| Minimum grutte fan ponsgat: | 0,5 mm |
| Soldermask tolerânsje: | +\-0,5 mm |
| Minimale tolerânsje foar routingdiminsje: | +\-0,5 mm |
| Oerflakte ôfwurking: | HASL, LF HASL, Immersion Silver, Immersion Gold, Flash Gold, OSP |
| Foarm: | Punchen, Laser, Cut |
| Apparatuer: | Universele tester |
| Flying Probe Iepen / Koarte Tester | |
| Hege krêft mikroskoop | |
| Solderability Testing Kit | |
| Peel Strength tester | |
| High Volt Open & Koarte tester | |
| Cross Section Molding Kit Mei Polisher | |
| Rigid & flex kapasiteit | |
| Lagen: | 1-28 lagen |
| Materiaal type: | FR-4 (hege Tg, halogeenfrij, hege frekwinsje) |
| PTFE, BT, Getek, Aluminiumbasis, Koperbasis, KB, Nanya, Shengyi, ITEQ, ILM, Isola, Nelco, Rogers, Arlon | |
| Board dikte: | 6-240 mil/0.15-6.0 mm |
| Koper dikte: | 210um (6oz) foar binnenste laach 210um (6oz) foar bûtenste laach |
| Min meganyske drill grutte: | 0.2mm/0.08" |
| Aspektferhâlding: | 2:01 |
| Max paniel grutte: | Sigle kant of dûbele kanten: 500mm * 1200mm |
| Mearlaach lagen: 508 mm X 610 mm (20 ″ X 24 ″) | |
| Min line breedte/romte: | 0.076 mm / 0.076 mm (0.003 ″ / 0.003 ″) / 3 mil / 3 mil |
| Type gat: | Blind / Buried / Plugged (VOP, VIP ...) |
| HDI / Microvia: | JA |
| Oerflakte ôfwurking: | HASL, LF HASL |
| Immersion Gold, Flash Gold, Gold finger | |
| Immersion Silver, Immersion Tin, OSP | |
| Selektyf gouden plating, gouddikte oant 3um (120u") | |
| Carbon Print, Peelable S/M, ENEPIG | |
| Foarm: | CNC, Punching, V-cut |
| Apparatuer: | Universele tester |
| Flying Probe Iepen / Koarte Tester | |
| Hege krêft mikroskoop | |
| Solderability Testing Kit | |
| Peel Strength tester | |
| High Volt Open & Koarte tester | |
| Cross Section Molding Kit Mei Polisher | |
Post tiid: Sep-05-2022
